DocumentCode
2357441
Title
Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311)
fYear
2002
fDate
12-14 March 2002
Abstract
The following topics are dealt with: advances in compact models; package and material characterization; device and component characterization and modeling; system level analysis; liquid cooling applications.
Keywords
cooling; integrated circuit measurement; integrated circuit modelling; multichip modules; semiconductor device models; thermal management (packaging); thermal variables measurement; compact models; component characterization; component modeling; device characterization; device modeling; liquid cooling applications; material characterization; package characterization; semiconductor thermal management; semiconductor thermal measurement; system level analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991337
Filename
991337
Link To Document