Abstract :
Materials selection impacts performance, reliability, weight, manufacturability and cost. A variety of new advanced composite and monolithic materials are now available that provide great advantages over conventional materials for dimensional stability and thermal management in microelectronic, optoelectronic, micro-opto-electromechanical (MOEMS) and micro-electro-mechanical (MEMS) packaging, including: extremely high thermal conductivities; tailorable coefficients of thermal expansion; extremely high strengths and stiffnesses; low densities; and low cost, net shape fabrication processes. Materials with low thermal conductivities and CTEs are also available. The payoffs are: improved fiber alignment; reduced thermal stresses and warpage; lower junction temperatures; simplified thermal design; possible elimination of heat pipes; weight savings up to 80%; size reductions up to 65%; increased reliability; increased manufacturing yield and cost reductions. There are many advanced packaging materials. They fall into five main categories, monolithic carbonaceous materials, metal matrix composites (MMCs), polymer matrix composites (PMCs), carbon/carbon composites (CCCs) and advanced metallic alloys.
Keywords :
fibre reinforced composites; filled polymers; micro-optics; micromechanical devices; reliability; thermal conductivity; thermal expansion; thermal management (packaging); thermal stresses; MEMS; MOEMS; coefficients of thermal expansion; cost; dimensional stability; junction temperatures; manufacturability; metal matrix composites; metallic alloys; microelectronic packaging; monolithic carbonaceous materials; optoelectronic packaging; polymer matrix composites; reliability; shape fabrication; stiffnesses; strengths; thermal conductivities; thermal management; thermal stresses; warpage; weight; Composite materials; Conducting materials; Costs; Manufacturing; Microelectronics; Packaging; Thermal conductivity; Thermal expansion; Thermal management; Thermal stresses;
