DocumentCode
2357560
Title
A multi level modeling approach with boundary condition import for system, sub-system or board level thermal characterization
Author
Shankaran, G.
Author_Institution
Fluent, Santa Clara, CA, USA
fYear
2002
fDate
12-14 March 2002
Firstpage
35
Lastpage
41
Abstract
Application of multi level approach with exact boundary condition import for performing accurate and time efficient CFD design calculations for a populated system cooled by forced air flow is studied. The approach involves a coarse system level model for determining appropriate boundary condition profiles for sub-systems, and a detailed sub-system level model that utilizes the boundary condition determined from the system level model. The advantages of the proposed approach are quantified by comparison with a detailed full system model. The size of the models in terms of mesh count and the accuracy of predicted component temperatures were the quantities compared. The acceptable errors of the multi level modeling approach with profile boundary conditions were in contrast with the multi-level modeling in which the boundary conditions were uniform nominal values or mean values of velocities and temperatures.
Keywords
computational fluid dynamics; cooling; forced convection; mesh generation; packaging; thermal analysis; CFD design calculations; board level thermal characterization; boundary condition; boundary condition import; coarse system level model; component temperatures; exact boundary condition; forced air flow; mesh count; multi level modeling approach; uniform nominal values; Accuracy; Boundary conditions; Computational fluid dynamics; Computational modeling; Electronic equipment; Heat sinks; Lead; Predictive models; Temperature; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991343
Filename
991343
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