• DocumentCode
    2357560
  • Title

    A multi level modeling approach with boundary condition import for system, sub-system or board level thermal characterization

  • Author

    Shankaran, G.

  • Author_Institution
    Fluent, Santa Clara, CA, USA
  • fYear
    2002
  • fDate
    12-14 March 2002
  • Firstpage
    35
  • Lastpage
    41
  • Abstract
    Application of multi level approach with exact boundary condition import for performing accurate and time efficient CFD design calculations for a populated system cooled by forced air flow is studied. The approach involves a coarse system level model for determining appropriate boundary condition profiles for sub-systems, and a detailed sub-system level model that utilizes the boundary condition determined from the system level model. The advantages of the proposed approach are quantified by comparison with a detailed full system model. The size of the models in terms of mesh count and the accuracy of predicted component temperatures were the quantities compared. The acceptable errors of the multi level modeling approach with profile boundary conditions were in contrast with the multi-level modeling in which the boundary conditions were uniform nominal values or mean values of velocities and temperatures.
  • Keywords
    computational fluid dynamics; cooling; forced convection; mesh generation; packaging; thermal analysis; CFD design calculations; board level thermal characterization; boundary condition; boundary condition import; coarse system level model; component temperatures; exact boundary condition; forced air flow; mesh count; multi level modeling approach; uniform nominal values; Accuracy; Boundary conditions; Computational fluid dynamics; Computational modeling; Electronic equipment; Heat sinks; Lead; Predictive models; Temperature; Thermal force;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7327-8
  • Type

    conf

  • DOI
    10.1109/STHERM.2002.991343
  • Filename
    991343