Title :
Inclusion of RC compact models of packages into board level thermal simulation tools
Author :
Rencz, M. ; Székely, V. ; Poppe, A. ; Courtois, B.
Author_Institution :
MicReD Ltd., Hungary
Abstract :
The paper presents an algorithm and a methodology for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables correct detailed consideration of the heat transfers in the board, and in addition the calculation of the exact junction temperatures in the packages. The methodology offers the possibility of considering individual heat transfer coefficients for each package, or even to each side of the package, depending on the compact models, and on user requirements. The main advantage is that the methodology keeps the extreme speed and user friendliness of the board level solvers.
Keywords :
circuit simulation; heat transfer; integrated circuit modelling; printed circuits; temperature distribution; thermal analysis; thermal management (packaging); PCBs; board heat transfer; board level solvers; board level thermal simulation tools; board/package co-simulation; co-simulation algorithm; co-simulation methodology; field solvers; heat transfer coefficients; network models; package RC compact models; package junction temperature; package surrounding area; physical domain; printed circuit boards; thermal transfer; Frequency domain analysis; Heat transfer; Impedance; Integrated circuit modeling; Laboratories; Packaging; Paper technology; Steady-state; Temperature; Thermal loading;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7327-8
DOI :
10.1109/STHERM.2002.991348