Title :
Numerical simulation of phase change heat transfer in PCM-encapsulated heat sinks
Author :
Liu, Beimen ; Majumdar, Pradip
Author_Institution :
Dept. of Mech. Eng., Northern Illinois Univ., DeKalb, IL, USA
Abstract :
The enthalpy-based computational model is developed for analysing PCM-encapsulated heat sinks for electronics chips. Solution is obtained by developing a control volume-based finite difference code and results are validated by comparing results with that given by analytical solution available for a limiting case problem. Preliminary results based on a parametric study indicate the two-dimensional code developed for this study can be used in evaluating PCM, and selecting geometrical dimensions of the PCM encapsulated heat sink.
Keywords :
circuit simulation; cooling; enthalpy; finite difference methods; heat sinks; integrated circuit modelling; integrated circuit packaging; solid-liquid transformations; thermal analysis; thermal management (packaging); 2D finite difference code; PCM-encapsulated heat sinks; control volume-based finite difference method; electronic chips; enthalpy-based computational model; geometrical dimensions; latent heat transfer; limiting case problem; numerical simulation; parametric study; phase change heat transfer; phase change materials; Conducting materials; Electronics cooling; Finite difference methods; Heat sinks; Heat transfer; Numerical simulation; Phase change materials; Solids; Temperature; Thermal conductivity;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7327-8
DOI :
10.1109/STHERM.2002.991351
