Title :
Improving simulation accuracy for SMT packages by incorporating trace level details in PCB thermal modeling
Author :
Swaminathan, V. ; Venkatakrishnan, G. ; Tan, Whei Sheng ; Ooi, Wei Meng
Author_Institution :
TCI, Delphi Automotive Syst. Pvt Ltd., Bangalore, India
Abstract :
The need for accurate trace level modeling is emphasized, by comparing simulated junction temperatures of a SMT package on a PCB under different combinations of trace layout. The results show that detail modeling of traces around the device has a significant impact on the predicted temperatures and over-simplified PCB models can cause unacceptable errors.
Keywords :
surface mount technology; thermal management (packaging); PCB thermal modeling; SMT package; junction temperature; simulation accuracy; trace level detail;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702630
