Finite element analysis of laser bonding process on organic light-emitting device

Organic light-emitting device (OLED) is regarded as the potential application for future display. However, one of the bottlenecks is the OLED package issue, which results in short term device lifetime. Currently, a new laser bonding package process is proposed. In this paper, the investigation of transient temperature field analysis for the laser bonding process is presented. Finite element model is applied in ANSYS and compiled by subroutine of APDL. Moving heat flux and birth-death element method are both adopted in order to achieve the complicated bonding process. The laser bonding process comes to quasi-steady state after a short time of initial transient stage. Through a series parameters simulation, parameters as moving velocity, laser power and laser beam radius show a significant effect on bonding process. Furthermore, by case study, the optimization of the bonding parameters was carried out for future experimental investigation and validation.