DocumentCode :
2357748
Title :
Experimental investigation of transport mechanisms through HfO2 gate stacks in nMOS transistors
Author :
Coignus, J. ; Leroux, C. ; Clerc, R. ; Ghibaudo, G. ; Reimbold, G. ; Boulanger, F.
Author_Institution :
IMEP-LAHC, MINATEC - Grenoble INP, Grenoble, France
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
169
Lastpage :
172
Abstract :
In order to investigate more accurately transport mechanisms through SiO2/HfO2 gate stacks, CV and IV measurements have been performed on several samples featuring different interfacial layer or HfO2 thicknesses, for a large range of temperature (80 K to 400 K). Experimental gate currents have been found to have very weak temperature dependency when plotted versus total charge, except on thicker stacks, in inversion regime, at 300 and 400 K. These results have been compared with direct tunneling (DT) simulations in inversion regime. This comparison has clearly shown that interfacial layer differs from pure SiO2, confirming previous theoretical works.
Keywords :
MOSFET; dielectric materials; hafnium compounds; high-k dielectric thin films; silicon compounds; tunnelling; C-V measurement; I-V measurement; SiO2-HfO2; direct tunneling simulations; gate current; gate stack; high-kappa materials; interfacial layer; inversion regime; nMOS transistor; temperature 80 K to 400 K; total charge; transport mechanism; CMOS technology; Dielectric materials; Gate leakage; Hafnium oxide; MOSFETs; Performance evaluation; Temperature dependence; Temperature distribution; Thickness measurement; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location :
Athens
ISSN :
1930-8876
Print_ISBN :
978-1-4244-4351-2
Electronic_ISBN :
1930-8876
Type :
conf
DOI :
10.1109/ESSDERC.2009.5331318
Filename :
5331318
Link To Document :
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