DocumentCode :
2357835
Title :
A comparison of critical area analysis tools [IC yield]
Author :
Fitzpatrick, Sean ; O´Donoghue, Geoffrey ; Cheek, Gary
Author_Institution :
Analog Devices Inc., Wilmington, MA, USA
fYear :
1998
fDate :
23-25 Sep 1998
Firstpage :
31
Lastpage :
33
Abstract :
The application of critical area analysis has become more mainstream in the semiconductor industry. The critical area of a circuit is a measure of the sensitivity of a product layout to defects, which is subsequently used in accurate yield models. Intuitively, if a circuit is more dense, the defect sensitivity is higher than a less dense circuit. Commercial tools have only recently become available to measure critical area. Several approaches have been developed to measure layout critical area. A short summary of each approach is described, as well as a brief description of how critical area is incorporated into a yield model. The results of applying critical area analysis tools are then described
Keywords :
Monte Carlo methods; circuit analysis computing; integrated circuit layout; integrated circuit modelling; integrated circuit yield; software tools; IC yield; Monte Carlo method; circuit critical area; circuit density; critical area analysis; critical area analysis tools; critical area measurement; defect sensitivity; layout critical area; product layout defect sensitivity; semiconductor industry; shape expansion method; yield model; yield models; Application software; Application specific integrated circuits; Area measurement; Electronics industry; Fabrication; Integrated circuit manufacture; Integrated circuit measurements; Manufacturing processes; Software measurement; Software tools;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4380-8
Type :
conf
DOI :
10.1109/ASMC.1998.731381
Filename :
731381
Link To Document :
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