Title :
Hot-melt adhesive method using metal foil induction heating and performance of long E-type core head
Author :
Obat, S. ; Sekine, T. ; Tomita, H.
Author_Institution :
Dept. of Electron. & Comput. Eng., Tokyo Denki Univ., Saitama
Abstract :
A safe induction heating adhesion (IHA) method for constructing furniture, houses, etc. is devised using a recyclable manufacturing system composed of hot-melt glue on metal foils, core heads and a 20 kHz inverter. A new type core heads are developed for performing the thick board adhesion. These processes are analyzed with a finite element method. Shield effects in the E-type core head are investigated for producing the power up head. It is concluded that this shield E-type core head has the highest performance in all of core heads now
Keywords :
adhesion; adhesives; finite element analysis; induction heating; invertors; 20 kHz; finite element method; hot-melt adhesive method; hot-melt glue; inverter; long E-type core head; metal foil induction heating; power up head; recyclable manufacturing system; shield effects; thick board adhesion; Circuits; Tellurium; Eddy curent; Flux control; Induction heating adhesion; Industrial application; simulation;
Conference_Titel :
Power Electronics and Applications, 2005 European Conference on
Conference_Location :
Dresden
Print_ISBN :
90-75815-09-3
DOI :
10.1109/EPE.2005.219366
