Title :
Case study of embedded memory failure analysis for dislocation issue
Author :
Cheng Wei Tang ; Shin Chia Lin ; Yi Chen Lin ; Mei Ying Hsiao ; Yau Shan Wu ; Chi Lin
Author_Institution :
Reliability Testing & Failure Anal. Dept., Powerchip Technol. Corp., Hsinchu, Taiwan
fDate :
June 30 2014-July 4 2014
Abstract :
Embedded memory is an integrated on-chip memory that supports the logic core to accomplish intended functions. High-performance embedded memory is a key component in VLSI, because of its high-speed and wide bus-width capability, which eliminates inter-chip communication. In this paper, embedded memory device and CMOS logic is integrated on-chip and it is a more complex of process technology compared with stand-alone memory. For the process engineering, we are always confronted with many problems, especially, the dislocation that causes some failures.
Keywords :
CMOS logic circuits; VLSI; dislocations; failure analysis; integrated memory circuits; CMOS logic; VLSI; dislocation issue; embedded memory device; embedded memory failure analysis; high-performance embedded memory; integrated on-chip memory; logic core; process technology; Current measurement; Failure analysis; Leakage currents; Microscopy; Rapid thermal annealing; System-on-chip;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898135