DocumentCode
235790
Title
Simple, novel and low cost numerical aperture increasing lens system for high resolution infrared image in backside failure analysis
Author
Li Tian
Author_Institution
Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
140
Lastpage
145
Abstract
As is known to all, we could capture clearer infrared (IR) image from backside as Si substrate was thinner. But if we needed higher resolution image with conventional optical objective lens, we must introduce numerical aperture increasing lens(NAIL) technology or shorter wavelength light to improve numerical aperture (NA) in objective space. Now some vendors can provide NanoLens with NAIL but it is very expensive. In this paper, we proposed one simple and novel system of NAIL. Firstly, we fabricated two NAILs (one R≈3mm, the other R≈ 5mm) with glass material, and captured higher resolution IR image with NAIL help. Secondly, we found clearer image from smaller size NAIL by comparing IR images. Then, we studied how to moving NAIL on backside surface of die. Two moving methods were designed and we discussed their advantage and disadvantage, one of them was used in FA experiment. Although there were some limitation and disadvantage for this system, we believed this simple, novel and low cost NAIL system was beneficial to our FA from backside.
Keywords
failure analysis; image resolution; infrared imaging; lenses; backside failure analysis; high resolution infrared image; numerical aperture increasing lens technology; Decision support systems; Failure analysis; Integrated circuits; Fialure analysis; IR image; NAIL system; T-4-10 probe needle;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898136
Filename
6898136
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