• DocumentCode
    235790
  • Title

    Simple, novel and low cost numerical aperture increasing lens system for high resolution infrared image in backside failure analysis

  • Author

    Li Tian

  • Author_Institution
    Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    140
  • Lastpage
    145
  • Abstract
    As is known to all, we could capture clearer infrared (IR) image from backside as Si substrate was thinner. But if we needed higher resolution image with conventional optical objective lens, we must introduce numerical aperture increasing lens(NAIL) technology or shorter wavelength light to improve numerical aperture (NA) in objective space. Now some vendors can provide NanoLens with NAIL but it is very expensive. In this paper, we proposed one simple and novel system of NAIL. Firstly, we fabricated two NAILs (one R≈3mm, the other R≈ 5mm) with glass material, and captured higher resolution IR image with NAIL help. Secondly, we found clearer image from smaller size NAIL by comparing IR images. Then, we studied how to moving NAIL on backside surface of die. Two moving methods were designed and we discussed their advantage and disadvantage, one of them was used in FA experiment. Although there were some limitation and disadvantage for this system, we believed this simple, novel and low cost NAIL system was beneficial to our FA from backside.
  • Keywords
    failure analysis; image resolution; infrared imaging; lenses; backside failure analysis; high resolution infrared image; numerical aperture increasing lens technology; Decision support systems; Failure analysis; Integrated circuits; Fialure analysis; IR image; NAIL system; T-4-10 probe needle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898136
  • Filename
    6898136