DocumentCode
2357963
Title
A parametric study of dielectric spray cooling of a row of heaters in a narrow channel
Author
Kearns, Don ; Du, Jian-Hua ; Chen, Ruey-Hung ; Chow, Louis C.
Author_Institution
Sun Microsystems, Inc., Palo Alto, CA, USA
fYear
2002
fDate
12-14 March 2002
Firstpage
164
Lastpage
168
Abstract
The cooling efficiency of dielectric liquid spray cooling in a narrow channel formed by two parallel simulated circuit boards was investigated as a function of fluid inlet temperature, supply pressure, heater temperature, power level, and channel length. The 400 mm channel was formed by a circuit board with a row of nine 38.1 mm square heat sources on one side, and a smooth acrylic plate 25 mm above. A single full cone atomizer (D0=0.33 mm) provided spray entering from one end which was directed parallel to and centered on the row of heaters. Reduction in fluid subcooling provided higher heat removal efficiency and uniform temperatures, at the expense of dryout on the final heater(s). Increases in liquid supply pressure improved heat removal efficiency at all heaters uniformly. The leading heater (centered at 23 mm downstream) was impinged more heavily and showed the highest heat removal efficiency (up to 14/spl times/10/sup -6/ W/m/sup 2/ K) and power handling of up to 60 W. Heater 9 (375 mm downstream) dissipated as much as 20 W, with heat transfer coefficients up to 2/spl times/10/sup -6/ W/m/sup 2/ K. Temperatures at all locations typically ranged from (35 to 70)/spl deg/C with as little as 2/spl deg/C variation from Heaters 1 to 8 (317 mm downstream).
Keywords
printed circuit design; sprays; undercooling; 20 W; 35 to 70 degC; 400 mm; 60 W; channel length; cooling efficiency; dielectric spray cooling; dryout; fluid inlet temperature; fluid subcooling; full cone atomizer; heat removal efficiency; heat transfer coefficients; heater temperature; narrow channel; parallel simulated circuit boards; power handling; power level; supply pressure; Application specific integrated circuits; Circuit simulation; Circuit testing; Dielectric liquids; Electronics cooling; Heat transfer; Parametric study; Printed circuits; Spraying; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991363
Filename
991363
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