DocumentCode :
2358026
Title :
Characterization of alumina-based LTCC composite materials: Thermal and electrical properties
Author :
Ibrahim, Azmi ; Alias, Rosidah ; Ambak, Zulkifli ; Yusoff, Mohd Zulfadli Mohamed ; Shapee, Sabrina Mohd ; Saad, Muhammad Redzuan ; Yusoff, Ashaari ; Mahmood, Che Seman ; Al Rashid Megat Ahmad, Megat Harun
fYear :
2010
fDate :
8-10 Dec. 2010
Firstpage :
269
Lastpage :
272
Abstract :
The study on Low temperature co-fired ceramic (LTCC) has been widely investigated due to its potential as an advanced approach for packaging of electronics devices. This paper evaluates and discusses about the firing temperatures effect on the densification, thermal and electrical properties of the prepared LTCC material. The LTCC tape, which consists mostly of Al2O3 was fabricated using tape casting technique. Five layers of tapes were then stacked and air-fired at different temperatures of 840, 880, 920 and 960°C. All samples were characterized for thermal and electrical properties. The crystallinity and microstructure of all samples were studied using XRD and SEM respectively. Current investigations show that the changing of density or volume fraction of pores is the main reason for the dielectric properties shift. Meanwhile, the changing in lattice parameters is observed as the main reason in thermal diffusivity shift. The sample fired at 880°C has the best thermal and electrical properties with thermal diffusivity of about 0.62 mm2/s, dielectric constant (εr) of about 5.65 and dielectric loss, tan (δ) of about 0.003.
Keywords :
alumina; ceramic packaging; crystal microstructure; densification; dielectric properties; firing (materials); tape casting; thermal management (packaging); Al2O3; LTCC material; SEM; XRD; alumina-based LTCC composite material; crystallinity; densification; density; dielectric properties; electrical properties; electronic device packaging; firing temperature effect; lattice parameter; low temperature co-fired ceramic; microstructure; tape casting technique; temperature 840 C; temperature 880 C; temperature 920 C; temperature 960 C; thermal diffusivity; thermal properties; volume fraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
Type :
conf
DOI :
10.1109/EPTC.2010.5702646
Filename :
5702646
Link To Document :
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