Title :
Electromigration reliability of solder bumps
Author :
Ceric, H. ; Selberherr, Siegfried
Author_Institution :
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fDate :
June 30 2014-July 4 2014
Abstract :
Characteristic of solder bumps is that during technology processing and usage their material composition changes. We present a model for describing a growth of intermetallic compound inside a solder bump under the influence of electro-migration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.
Keywords :
alloys; electromigration; integrated circuit reliability; soldering; solders; electromigration reliability; intermetallic compound; solder bumps; Chemicals; Electromigration; Integrated circuit interconnections; Nickel; Reliability; Resistance; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898145
