Title :
Chip fabrication services for universities in North America and Europe
Author_Institution :
Fac. of Syst. Eng., Shibaura Inst. of Technol., Omiya, Japan
Abstract :
This paper reviews the chip fabrication services for universities in North America and European countries. One feature of these services is the adoption of a chip fabrication system (called Multiproject Chip) that makes it possible for users at universities to fabricate chips at an extremely low cost. The key idea of the multiproject chip system is that sharing a chip or a wafer among several projects makes it possible to greatly reduce manufacturing costs. The paper covers MOSIS (USA), CMC (Canada), CMP (France), EIS (Germany) and Eurochip (Europe) services. Those services have clearly been making great contributions to increasing the expertise in LSI design at universities
Keywords :
VLSI; circuit CAD; integrated circuit design; integrated circuit manufacture; integrated circuit technology; CAD tools; CMC; CMP; EIS; Eurochip; Europe; LSI design; MOSIS; North America; chip fabrication services; low cost fabrication; manufacturing cost reduction; multiproject chip service; universities; wafer sharing; CMOS technology; Chip scale packaging; Costs; Educational institutions; Europe; Foundries; Large scale integration; Manufacturing; North America; Very large scale integration;
Conference_Titel :
Circuits and Systems, 1994. APCCAS '94., 1994 IEEE Asia-Pacific Conference on
Conference_Location :
Taipei
Print_ISBN :
0-7803-2440-4
DOI :
10.1109/APCCAS.1994.514607
