• DocumentCode
    2358186
  • Title

    Test chips for advanced packaging

  • Author

    Reinert, Wolfgang ; Kähler, Dirk

  • Author_Institution
    Fraunhofer Inst. for Silicon Technol., Itzehoe, Germany
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    325
  • Lastpage
    327
  • Abstract
    Electronic packaging is advancing very fast and often a gap between availability of first functional chips and the need to develop their packaging processes and bill of materials exists. With the use of test chips and 200 mm test wafers from a qualified industrial wafer fab, this gap can be shrinked both in respect to timing as well as in gaining first production experience on high volume.
  • Keywords
    wafer level packaging; electronic packaging; first functional chip; industrial wafer fab; size 200 mm; test chips; test wafers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702656
  • Filename
    5702656
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2358186