DocumentCode
235824
Title
Inverted scan transducer mount technique: A cost effective acoustic scanning of IGBT modules for failure analysis
Author
De La Cruz, Em Julius ; De La Rea, Sheenel Karl ; McDonough, Suzanne ; Chai, S.F.
Author_Institution
ON Semicond. Malaysia Sdn. Bhd., Seremban, Malaysia
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
127
Lastpage
130
Abstract
Acoustic Scanning for IGBT modules is a critical process to find anomalies that could lead to field failures. However, the cost to build this capability for failure analysis use is relatively expensive. This paper aims at evaluating a cost effective acoustic scanning technique for IGBT modules suitable for failure.
Keywords
acoustic transducers; failure analysis; insulated gate bipolar transistors; IGBT modules; cost effective acoustic scanning; failure analysis; inverted scan transducer mount technique; Acoustics; Ceramics; Failure analysis; Insulated gate bipolar transistors; Thickness measurement; Transducers; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898152
Filename
6898152
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