• DocumentCode
    235837
  • Title

    Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB

  • Author

    Moreau, Sandrine ; Bouchu, D. ; Audoit, G.

  • Author_Institution
    Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    231
  • Lastpage
    235
  • Abstract
    The present methodology proposes to reduce curtaining artifacts using a plasma-FIB when milling relatively deep trenches. Finally, the methodology is very fast (<;1 h), simple to set up and can be automated. Its purpose consists in eliminating or reducing the origin of curtaining artifacts by judicious milling. This methodology can advantageously replace the rocking method presented in the literature.
  • Keywords
    ion beam applications; milling; three-dimensional integrated circuits; P-FIB; deep trenches; judicious milling; plasma-field ion beam; reduced curtaining artifacts; sample preparation; Decision support systems; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898159
  • Filename
    6898159