DocumentCode :
235837
Title :
Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB
Author :
Moreau, Sandrine ; Bouchu, D. ; Audoit, G.
Author_Institution :
Univ. Grenoble Alpes, Grenoble, France
fYear :
2014
fDate :
June 30 2014-July 4 2014
Firstpage :
231
Lastpage :
235
Abstract :
The present methodology proposes to reduce curtaining artifacts using a plasma-FIB when milling relatively deep trenches. Finally, the methodology is very fast (<;1 h), simple to set up and can be automated. Its purpose consists in eliminating or reducing the origin of curtaining artifacts by judicious milling. This methodology can advantageously replace the rocking method presented in the literature.
Keywords :
ion beam applications; milling; three-dimensional integrated circuits; P-FIB; deep trenches; judicious milling; plasma-field ion beam; reduced curtaining artifacts; sample preparation; Decision support systems; Failure analysis; Integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
ISSN :
1946-1542
Print_ISBN :
978-1-4799-3931-2
Type :
conf
DOI :
10.1109/IPFA.2014.6898159
Filename :
6898159
Link To Document :
بازگشت