DocumentCode
235837
Title
Fast and easy sample preparation with reduced curtaining artifacts using a P-FIB
Author
Moreau, Sandrine ; Bouchu, D. ; Audoit, G.
Author_Institution
Univ. Grenoble Alpes, Grenoble, France
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
231
Lastpage
235
Abstract
The present methodology proposes to reduce curtaining artifacts using a plasma-FIB when milling relatively deep trenches. Finally, the methodology is very fast (<;1 h), simple to set up and can be automated. Its purpose consists in eliminating or reducing the origin of curtaining artifacts by judicious milling. This methodology can advantageously replace the rocking method presented in the literature.
Keywords
ion beam applications; milling; three-dimensional integrated circuits; P-FIB; deep trenches; judicious milling; plasma-field ion beam; reduced curtaining artifacts; sample preparation; Decision support systems; Failure analysis; Integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898159
Filename
6898159
Link To Document