Title :
Cumulative bibliography of articles on semiconductor thermal and temperature testing-1991
Author_Institution :
OAI/SAGE, Milpitas, CA, USA
Abstract :
A bibliography that provides information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is presented. Many of the papers were presented at previous SEMI-THERM Symposia
Keywords :
integrated circuit testing; packaging; semiconductor device testing; semiconductor technology; temperature measurement; thermal analysis; bibliography; hardware applications; measurement techniques; semiconductor; temperature testing; thermal characteristics; Bibliographies; Electronic packaging thermal management; Integrated circuit packaging; Microassembly; Microscopy; Plastic packaging; Semiconductor device reliability; Semiconductor device testing; Temperature measurement; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-87942-664-0
DOI :
10.1109/STHERM.1991.152930
