• DocumentCode
    2358459
  • Title

    Cumulative bibliography of articles on semiconductor thermal and temperature testing-1991

  • Author

    Siegal, Bernard

  • Author_Institution
    OAI/SAGE, Milpitas, CA, USA
  • fYear
    1991
  • fDate
    12-14 Feb 1991
  • Firstpage
    151
  • Lastpage
    174
  • Abstract
    A bibliography that provides information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is presented. Many of the papers were presented at previous SEMI-THERM Symposia
  • Keywords
    integrated circuit testing; packaging; semiconductor device testing; semiconductor technology; temperature measurement; thermal analysis; bibliography; hardware applications; measurement techniques; semiconductor; temperature testing; thermal characteristics; Bibliographies; Electronic packaging thermal management; Integrated circuit packaging; Microassembly; Microscopy; Plastic packaging; Semiconductor device reliability; Semiconductor device testing; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    0-87942-664-0
  • Type

    conf

  • DOI
    10.1109/STHERM.1991.152930
  • Filename
    152930