• DocumentCode
    235848
  • Title

    Temperature effect on reflected laser probing signal of multiple elementary substructures

  • Author

    Rebai, M.M. ; Darracq, F. ; Guillet, Jean-Paul ; Lewis, David ; Perdu, P. ; Sanchez, K.

  • Author_Institution
    IMS Lab., Univ. of Bordeaux, Talence, France
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    370
  • Lastpage
    374
  • Abstract
    Electro-Optical Probing (EOP) has shown its efficiency in the world of failure analysis. The different external physical parameters effects, especially the temperature, on the EOP signals are not well known and not that much described in the literature. In addition to thermoreflectance, the temperature is a parameter that affects directly the free carrier´s distribution and carrier mobilities inside the semiconductor. Temperature also modifies the absorption coefficient and not only the refractive index as known in the thermo-reflectance domain. All the physical and environmental parameters contribute to the modulation of the reflected laser probing beam onto structures under test. In this paper we will expose the origins of the reflected laser beam and the impact of the temperature on the EOP signal. For the first time, all the parameters, including temperature, have been taken into account. It opens the door of laser probing techniques improvements in failure analysis of submicron devices.
  • Keywords
    electro-optical effects; failure analysis; laser beams; semiconductor lasers; absorption coefficient; electrooptical probing; failure analysis; laser probing techniques; multiple elementary substructures; reflected laser beam; reflected laser probing signal; refractive index; submicron devices; temperature effect; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898165
  • Filename
    6898165