DocumentCode
2358507
Title
Analysis of the dynamic characteristics of a power semiconductor module, considering the influence of electromagnetic coupling between wiring
Author
Usui, Osamu ; Nakatake, Hiroshi ; Ohi, Takeshi
Author_Institution
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo
fYear
2005
fDate
11-14 Sept. 2005
Abstract
The dynamic characteristics of power semiconductor modules were investigated. The switching behavior of power modules is strongly influenced by electromagnetic coupling. Therefore to design highly reliable power modules, it is important to establish a method of analyzing their dynamic characteristics which considers these electromagnetic phenomena. The parasitic parameters of wiring in a power semiconductor module were determined using three-dimensional electromagnetic field analysis and their dynamic characteristics were analyzed using these parameters. The analysis results showed good agreement with the experimental results
Keywords
electromagnetic coupling; power semiconductor switches; wiring; electromagnetic coupling; power semiconductor module dynamic characteristics; switching behavior; three-dimensional electromagnetic field analysis; wiring parasitic parameters; Circuits; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic fields; Insulated gate bipolar transistors; Multichip modules; Power semiconductor switches; Semiconductor diodes; Voltage; Wiring; Electromagnetic Coupling; Electromagnetic Field Analysis; Parasitic Parameter; Power Semiconductor Module;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2005 European Conference on
Conference_Location
Dresden
Print_ISBN
90-75815-09-3
Type
conf
DOI
10.1109/EPE.2005.219404
Filename
1665594
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