• DocumentCode
    2358507
  • Title

    Analysis of the dynamic characteristics of a power semiconductor module, considering the influence of electromagnetic coupling between wiring

  • Author

    Usui, Osamu ; Nakatake, Hiroshi ; Ohi, Takeshi

  • Author_Institution
    Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo
  • fYear
    2005
  • fDate
    11-14 Sept. 2005
  • Abstract
    The dynamic characteristics of power semiconductor modules were investigated. The switching behavior of power modules is strongly influenced by electromagnetic coupling. Therefore to design highly reliable power modules, it is important to establish a method of analyzing their dynamic characteristics which considers these electromagnetic phenomena. The parasitic parameters of wiring in a power semiconductor module were determined using three-dimensional electromagnetic field analysis and their dynamic characteristics were analyzed using these parameters. The analysis results showed good agreement with the experimental results
  • Keywords
    electromagnetic coupling; power semiconductor switches; wiring; electromagnetic coupling; power semiconductor module dynamic characteristics; switching behavior; three-dimensional electromagnetic field analysis; wiring parasitic parameters; Circuits; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic fields; Insulated gate bipolar transistors; Multichip modules; Power semiconductor switches; Semiconductor diodes; Voltage; Wiring; Electromagnetic Coupling; Electromagnetic Field Analysis; Parasitic Parameter; Power Semiconductor Module;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications, 2005 European Conference on
  • Conference_Location
    Dresden
  • Print_ISBN
    90-75815-09-3
  • Type

    conf

  • DOI
    10.1109/EPE.2005.219404
  • Filename
    1665594