Title :
Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique
Author_Institution :
Infineon Technol. (Kulim), Sdn. Bhd., Kulim, Malaysia
fDate :
June 30 2014-July 4 2014
Abstract :
The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.
Keywords :
aluminium alloys; copper alloys; electron diffraction; electron probes; lead bonding; transmission electron microscopy; Cu-Al; TEM nano beam diffraction indexing technique; electron diffraction spot indexing; electron probe; intermetallic phases; standard scanning transmission electron microscopy; wire bonding; Cameras; Crystals; Diffraction; Indexing; Intermetallic; Wires; X-ray diffraction;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898172
