• DocumentCode
    235858
  • Title

    Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique

  • Author

    Yong, F.K.

  • Author_Institution
    Infineon Technol. (Kulim), Sdn. Bhd., Kulim, Malaysia
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    287
  • Lastpage
    290
  • Abstract
    The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.
  • Keywords
    aluminium alloys; copper alloys; electron diffraction; electron probes; lead bonding; transmission electron microscopy; Cu-Al; TEM nano beam diffraction indexing technique; electron diffraction spot indexing; electron probe; intermetallic phases; standard scanning transmission electron microscopy; wire bonding; Cameras; Crystals; Diffraction; Indexing; Intermetallic; Wires; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898172
  • Filename
    6898172
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235858