Title :
Sampling methodology for SEM-based defect classification: risk, cost, and benefit analysis
Author :
Akella, Ram ; Lin, Chih-Hung ; Chitturi, Prasanna
Author_Institution :
Stanford Univ., CA, USA
Abstract :
This paper analyzes the relative merits of optical and SEM-based defect classification systems, the needs and costs associated with these systems, and the factors limiting the usability of these systems. In particular, we consider the impact of throughput rate and classification accuracy on excursion detection and the resulting economic benefits. The paper includes a discussion of these models and a comparison is made to obtain the maximum benefits from existing optical and SEM review and classification methodologies. Scenarios for 0.25 μm fabs are used to indicate the procedures and policies that are the most effective from a fab economic perspective
Keywords :
automatic optical inspection; cost-benefit analysis; fault location; inspection; integrated circuit economics; integrated circuit testing; integrated circuit yield; production testing; scanning electron microscopy; semiconductor process modelling; 0.25 micron; SEM review/classification methodologies; SEM-based defect classification; SEM-based defect classification systems; benefit analysis; cost analysis; defect classification accuracy; economic benefits; excursion detection; fab economic perspective; models; optical review/classification methodologies; optical-based defect classification systems; risk analysis; sampling methodology; system usability; throughput rate; Cost benefit analysis; Inspection; Optical materials; Risk analysis; Sampling methods; Semiconductor device manufacture; Semiconductor device modeling; Technology management; Throughput; Usability;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4380-8
DOI :
10.1109/ASMC.1998.731418
