DocumentCode
2358761
Title
Improved inspection of miniaturised interconnections by digital X-ray inspection and computed tomography
Author
Roth, Holger ; Neubrand, Tobias ; Mayer, Thomas
Author_Institution
GE Sensing & Inspection Technol. GmbH, Stuttgart, Germany
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
441
Lastpage
444
Abstract
The 50 μm microvias of an defective embedded device were inspected non-destructively by both highly resolving microfocus computed tomography and improved digital X-ray imaging. Voids were found within the via fills and open interconnections between vias and pads were detected by the X-ray inspections. These defects could be verified and visualised in three dimensions by nanofocus CT.
Keywords
computerised tomography; electronics packaging; inspection; nondestructive testing; digital X-ray imaging; digital X-ray inspection; microfocus computed tomography; miniaturised interconnection; nanofocus CT; size 50 micron;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702680
Filename
5702680
Link To Document