• DocumentCode
    2358779
  • Title

    Thermo-mechanical challenges in the longevity of micro-electronics

  • Author

    Gielen, A.W.J.

  • Author_Institution
    TNO Sci. & Ind., Eindhoven, Netherlands
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are key to accelerated lifetime testing, are becoming to small as the operational conditions are nearing the testing conditions (automotive electronics under the hood) or are insuffiently large to obtain acceptable testing times (SSL and Solar). Trends and drivers for this are described. The some fundamental issues are presented for the mission profiles, failure and degradation mechanisms, as well as the acceleration factors. Ideas to overcome the presented limitations are shown in a combined testing-modelling scheme with some examples highlighting aspects of these ideas.
  • Keywords
    electronics industry; failure analysis; integrated circuits; life testing; acceleration factors; automotive electronics; degradation mechanism; failure mechanism; lifetime assessment methods; micro-electronics longevity; mission profiles; solar cells; solid-state-lighting; Automotive electronics; Consumer electronics; Degradation; Driver circuits; Electronic equipment testing; Life testing; Photovoltaic cells; Production; Thermomechanical processes; Warranties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
  • Conference_Location
    Bordeaux
  • Print_ISBN
    978-1-4244-7026-6
  • Type

    conf

  • DOI
    10.1109/ESIME.2010.5464507
  • Filename
    5464507