Title :
Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal
Author :
Poo Khai Yee ; Wan Tatt Wai ; Yong Foo Khong
Author_Institution :
Infineon Technol. (Kulim) Sdn Bhd, Kulim, Malaysia
fDate :
June 30 2014-July 4 2014
Abstract :
Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.
Keywords :
copper; diffusion; electroless deposition; electroplating; failure analysis; integrated circuit interconnections; lead bonding; nickel; palladium; semiconductor device metallisation; Ni; Pd-Cu; chemical solution; copper activation process; copper metallization; copper power metal; electroless nickel deposition; electroless nickel plating process; flow rate variation; palladium layer; palladium-copper interdiffusion behavior; physical failure analysis; Decision support systems; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898185
