Title :
Characterization of wet chemical etching for effective backside sample preparation on devices with exposed pads
Author :
Sabate, Andrew C. ; Galarce, Rowin V.
Author_Institution :
Product Anal. Lab., ON Semicond. Malaysia Sbn Bhd, Seremban, Malaysia
fDate :
June 30 2014-July 4 2014
Abstract :
With the growing complexity of Integrated Circuit (IC) design having multiple metallization layers and copper wire bonded devices, most of the time backside fault isolation is a better approach. This paper evaluated wet chemical backside sample preparation as an alternative method for the traditional milling/polishing backside sample preparation.
Keywords :
etching; fault diagnosis; integrated circuit metallisation; integrated circuit testing; lead bonding; backside fault isolation; backside polishing alternative; copper wire bonded device; exposed pad; integrated circuit design; metallization layer; traditional milling alternative; wet chemical backside sample preparation; wet chemical etching; Chemicals; Circuit faults; Etching; Failure analysis; Integrated circuits; Milling; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898186
