DocumentCode :
2359126
Title :
Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots
Author :
Oswald, M. ; Turek, M. ; Bagdahn, J.
Author_Institution :
Fraunhofer Center for Silicon Photovoltaics, Halle, Germany
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
1
Lastpage :
5
Abstract :
Silicon is an important semiconductor substrate for manufacturing solar cells. The mechanical and electrical properties of multi-crystalline silicon (mc-Si) are primarily influenced by the quality of the feedstock material and the crystallization process. In this work, numerical calculations, applying finite element analysis (FEA) and finite volume methods (FVM) are presented, in order to predict thermo-mechanical stresses during the solidification of industrial size mc-Si ingots. A two-dimensional global model of an industrial multi-crystallization furnace was created for thermal stationary and time-dependent calculations using the software tool CrysMAS. Subsequent thermo-mechanical analyses of the silica crucible and the ingot were performed with the FEA code ANSYS, allowing additional calculations to define mechanical boundary conditions as well as material models. Our results show that thermal analyses are in good agreement with experimental measurements. Furthermore we show that our approach is suitable to describe the generation of thermo-mechanical stress within the silicon ingot.
Keywords :
casting; finite element analysis; finite volume methods; ingots; solar cells; stress analysis; thermal analysis; thermomechanical treatment; FEA; FVM; crystallization process; feedstock material; finite element analysis; finite volume methods; multicrystalline silicon ingots; numerical simulations; semiconductor substrate; software tool CrysMAS; solar cell manufacturing; thermomechanical stresses; time-dependent calculations; Casting; Crystalline materials; Mechanical factors; Numerical simulation; Photovoltaic cells; Semiconductor device manufacture; Silicon; Substrates; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
Type :
conf
DOI :
10.1109/ESIME.2010.5464525
Filename :
5464525
Link To Document :
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