Embedded wafer level BGA (eWLB) - Multi-die

Author

Anandan, Ramasamy ; Jin, Yonggang ; Huang, Yaohuang ; Gan, Kah Wee ; Chua, Puay Gek ; Liu, Yun ; Geissler, Christian ; Hwa, Goh Hin

Author_Institution

STMicroelectronics, Singapore, Singapore

fYear

2010

fDate

8-10 Dec. 2010

Firstpage

868

Lastpage

873

Abstract

Although single die eWLB has been around for quite some time, processing of multi-die packages can pose many challenges. In multi-die eWLB package, two or more dies are placed side by side with a small gap, encapsulated by mold compound and interconnected with redistributed layers (RDL) and solder balls. The objective of this paper is to share the challenges in processing multi-die eWLB packages, potential solutions, key processes, results of die position measurements, mold filling, construction analysis, package level and board level reliability tests.

Keywords

ball grid arrays; encapsulation; integrated circuit interconnections; integrated circuit reliability; moulding; solders; wafer level packaging; board level reliability; construction analysis; die position measurements; embedded wafer level BGA; encapsulation; interconnection; mold compound; mold filling; multidie eWLB package; package level; redistributed layers; single die eWLB; solder balls;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2010 12th

Conference_Location

Singapore

Print_ISBN

978-1-4244-8560-4

Electronic_ISBN

978-1-4244-8561-1

Type

conf

DOI

10.1109/EPTC.2010.5702697

Filename

5702697