The integration of EWOD and SAW technologies for improved droplet manipulation and mixing

Author

Li, Y. ; Flynn, B.W. ; Parkes, W. ; Liu, Y. ; Feng, Y. ; Ruthven, A.D. ; Terry, J.G. ; Haworth, L.I. ; Bunting, A. ; Stevenson, J.T.M. ; Smith, S. ; Bobbili, P. ; Fu, Y.Q. ; Walton, A.J.

Author_Institution

Scottish Microelectron. Centre, Univ. of Edinburgh, Edinburgh, UK

fYear

2009

fDate

14-18 Sept. 2009

Firstpage

371

Lastpage

374

Abstract

This paper details the first reported integration of two advanced digital microfluidic technologies where 100 mum silicon cubes are transported with electrowetting on dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a surface acoustic wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNbO₃ substrates used low temperature Ta/Ta₂O₅/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.

Keywords

acoustic applications; bioMEMS; biological techniques; dielectric materials; drops; elemental semiconductors; lab-on-a-chip; lithium compounds; microfluidics; mixing; silicon; surface acoustic waves; tantalum; tantalum compounds; wetting; CYTOP layer; EWOD technology; LiNbO₃; SAW technology; Si; Ta-Ta₂O₅; biosensing; dielectric substrate; digital microfluidic technology; droplet generation; droplet manipulation; droplet splitting; droplet transportation; electrowetting; lab-on-a-chip; low temperature deposition; mixing; patterning technology; silicon cubes; size 100 mum; surface acoustic wave; Acoustic waves; Biosensors; Dielectric liquids; Fabrication; Lab-on-a-chip; Microfluidics; Silicon; Surface acoustic waves; Temperature; Transportation;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European

Conference_Location

Athens

ISSN

1930-8876

Print_ISBN

978-1-4244-4351-2

Electronic_ISBN

1930-8876

Type

conf

DOI

10.1109/ESSDERC.2009.5331396

Filename

5331396