DocumentCode :
2359484
Title :
The integration of EWOD and SAW technologies for improved droplet manipulation and mixing
Author :
Li, Y. ; Flynn, B.W. ; Parkes, W. ; Liu, Y. ; Feng, Y. ; Ruthven, A.D. ; Terry, J.G. ; Haworth, L.I. ; Bunting, A. ; Stevenson, J.T.M. ; Smith, S. ; Bobbili, P. ; Fu, Y.Q. ; Walton, A.J.
Author_Institution :
Scottish Microelectron. Centre, Univ. of Edinburgh, Edinburgh, UK
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
371
Lastpage :
374
Abstract :
This paper details the first reported integration of two advanced digital microfluidic technologies where 100 mum silicon cubes are transported with electrowetting on dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a surface acoustic wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNbO3 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.
Keywords :
acoustic applications; bioMEMS; biological techniques; dielectric materials; drops; elemental semiconductors; lab-on-a-chip; lithium compounds; microfluidics; mixing; silicon; surface acoustic waves; tantalum; tantalum compounds; wetting; CYTOP layer; EWOD technology; LiNbO3; SAW technology; Si; Ta-Ta2O5; biosensing; dielectric substrate; digital microfluidic technology; droplet generation; droplet manipulation; droplet splitting; droplet transportation; electrowetting; lab-on-a-chip; low temperature deposition; mixing; patterning technology; silicon cubes; size 100 mum; surface acoustic wave; Acoustic waves; Biosensors; Dielectric liquids; Fabrication; Lab-on-a-chip; Microfluidics; Silicon; Surface acoustic waves; Temperature; Transportation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location :
Athens
ISSN :
1930-8876
Print_ISBN :
978-1-4244-4351-2
Electronic_ISBN :
1930-8876
Type :
conf
DOI :
10.1109/ESSDERC.2009.5331396
Filename :
5331396
Link To Document :
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