DocumentCode
2359694
Title
Finite Element modelling of adhesion phenomena in MEMS
Author
Ardito, Raffaele ; Corigliano, Alberto ; Frangi, Attilio
Author_Institution
Dept. of Struct. Eng., Politec. di Milano, Milan, Italy
fYear
2010
fDate
26-28 April 2010
Firstpage
1
Lastpage
6
Abstract
In the last years many research works were focused on adhesion in micro-electro-mechanical systems (MEMS). In fact, that phenomenon can endanger the reliability of MEMS, both during the fabrication phase and in the operation conditions. The aim of the present study is to simulate the adhesion phenomena in different environmental conditions, by using Finite Element (FE) computational simulations on a representative part of the surface. A significant part of the work is devoted to the proper generation of FE model for artificial rough surfaces. The micro-scale analyses include the contact behavior of the asperities and the mechanical deformation of the bulk material, which is modeled as elastic-plastic. Some numerical results are presented and compared to previously published data.
Keywords
adhesion; deformation; environmental factors; finite element analysis; mechanical contact; micromechanical devices; reliability; MEMS; adhesion phenomena; computational simulations; contact behavior; environmental conditions; finite element modelling; mechanical deformation; micro-electro-mechanical systems; reliability; Adhesives; Atomic force microscopy; Computational modeling; Finite element methods; Force measurement; Friction; Micromechanical devices; Rough surfaces; Surface cracks; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location
Bordeaux
Print_ISBN
978-1-4244-7026-6
Type
conf
DOI
10.1109/ESIME.2010.5464550
Filename
5464550
Link To Document