DocumentCode :
2359694
Title :
Finite Element modelling of adhesion phenomena in MEMS
Author :
Ardito, Raffaele ; Corigliano, Alberto ; Frangi, Attilio
Author_Institution :
Dept. of Struct. Eng., Politec. di Milano, Milan, Italy
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
1
Lastpage :
6
Abstract :
In the last years many research works were focused on adhesion in micro-electro-mechanical systems (MEMS). In fact, that phenomenon can endanger the reliability of MEMS, both during the fabrication phase and in the operation conditions. The aim of the present study is to simulate the adhesion phenomena in different environmental conditions, by using Finite Element (FE) computational simulations on a representative part of the surface. A significant part of the work is devoted to the proper generation of FE model for artificial rough surfaces. The micro-scale analyses include the contact behavior of the asperities and the mechanical deformation of the bulk material, which is modeled as elastic-plastic. Some numerical results are presented and compared to previously published data.
Keywords :
adhesion; deformation; environmental factors; finite element analysis; mechanical contact; micromechanical devices; reliability; MEMS; adhesion phenomena; computational simulations; contact behavior; environmental conditions; finite element modelling; mechanical deformation; micro-electro-mechanical systems; reliability; Adhesives; Atomic force microscopy; Computational modeling; Finite element methods; Force measurement; Friction; Micromechanical devices; Rough surfaces; Surface cracks; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
Type :
conf
DOI :
10.1109/ESIME.2010.5464550
Filename :
5464550
Link To Document :
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