• DocumentCode
    2359711
  • Title

    Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors

  • Author

    Wiese, Steffen ; Meier, Rico ; Kraemer, Frank

  • Author_Institution
    Fraunhofer Center for Silicon Photovoltaics, Halle, Germany
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires are heat up and expand. During the subsequent cooling phase they contract. The differential contraction between the Cu and the Si combined with thermal gradients, causes mechanical stress in the assembly. Moreover the lifetime of solar modules can be limited by the fatigue of the copper-ribbons. Since the front glass and the silicon cells have a significant difference in their coefficients of thermal expansion, temperature fluctuations are able to induce thermo-mechanical stresses in the photovoltaic module. The paper will present the results of the mechanical tests on copper materials. In order to give an explanation for the fatigue behaviour of the material, a correlation to the relevant microstructures will be given. Based on the investigated mechanical behaviour practical implications for proper handling of copper ribbons during solar module production processes will be concluded.
  • Keywords
    fatigue; solar cells; stress analysis; copper ribbon fatigue; copper ribbons; differential contraction; mechanical behaviour; mechanical stresses; photovoltaic module; photovoltaic modules; solar cell interconnectors; solar cell string soldering; subsequent cooling phase; temperature fluctuations; thermal expansion; thermal gradients; Copper; Fatigue; Photovoltaic cells; Photovoltaic systems; Production; Solar power generation; Soldering; Temperature; Thermal stresses; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
  • Conference_Location
    Bordeaux
  • Print_ISBN
    978-1-4244-7026-6
  • Type

    conf

  • DOI
    10.1109/ESIME.2010.5464551
  • Filename
    5464551