• DocumentCode
    2359780
  • Title

    Filling the technology gap through balanced joint development projects and contracted independent research providers

  • Author

    Runnels, Scott ; Miceli, Frank ; Kim, Inki ; Easter, Bill

  • Author_Institution
    Southwest Res. Inst., San Antonio, TX, USA
  • fYear
    1998
  • fDate
    23-25 Sep 1998
  • Firstpage
    138
  • Lastpage
    141
  • Abstract
    Over the past several years, a noticeable amount of the semiconductor manufacturing industry´s overall R&D burden has shifted from chip manufacturer to equipment supplier. However, it is difficult for equipment suppliers to support the permanent dedicated research staff required to bear their increasing R&D burden. Likewise, their counterparts inside the chip manufacturer are urged to focus on current process development, integration, and efficiency issues. This shift in the R&D burden has been widely recognized in the supplier community, which has referred to it as the “technology gap”. This paper describes one way of dealing with that technology gap. A successful joint development project (JDP) between SpeedFam Corporation and Lucent Technologies is described and used to exemplify how the R&D burden can be properly balanced by allowing each organization to focus on their core competency. Key to the success of the JDP was the use of private, independent R&D supplied under contract by Southwest Research Institute, which also helped facilitate the balance through preliminary self-funded R&D. The paper explains how issues regarding intellectual property protection and ownership were successfully resolved and briefly describes the technology produced from the project
  • Keywords
    industrial property; integrated circuit design; integrated circuit technology; outsourcing; personnel; product development; research and development management; R&D burden; balanced joint development projects; chip manufacturer; contracted independent research providers; core competency; equipment supplier; independent R&D supply; intellectual property ownership; intellectual property protection; joint development project; permanent dedicated research staff; preliminary self-funded R&D; process development; process efficiency; process integration; semiconductor manufacturing industry; supplier community; technology gap; technology gap filling; Contracts; Filling; Intellectual property; Lead compounds; Manufacturing industries; Manufacturing processes; Productivity; Protection; Research and development; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-4380-8
  • Type

    conf

  • DOI
    10.1109/ASMC.1998.731472
  • Filename
    731472