• DocumentCode
    2359820
  • Title

    Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

  • Author

    Tohmyoh, Hironori ; Takeda, Hironao ; Khan, Mohammed N I ; Saka, Masumi

  • Author_Institution
    Dept. of Nanomech., Tohoku Univ., Sendai, Japan
  • fYear
    2010
  • fDate
    26-28 April 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 ¿m are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 ¿V/K. The temperature distribution of 5 ¿m Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.
  • Keywords
    Seebeck effect; copper; integrated circuit interconnections; platinum; temperature distribution; thermocouples; tungsten; welding; Joule heat welding; Pt-W-Cu; Seebeck effect; air grove; electro thermal circuit; freestanding thin thermocouple; size 5 mum; small chip; temperature 293 K to 298 K; temperature distribution; thermoelectric element; Circuits; Electrodes; Fabrication; Heating; Temperature control; Thermoelectricity; Voltage; Voltmeters; Welding; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
  • Conference_Location
    Bordeaux
  • Print_ISBN
    978-1-4244-7026-6
  • Type

    conf

  • DOI
    10.1109/ESIME.2010.5464556
  • Filename
    5464556