DocumentCode
2359820
Title
Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding
Author
Tohmyoh, Hironori ; Takeda, Hironao ; Khan, Mohammed N I ; Saka, Masumi
Author_Institution
Dept. of Nanomech., Tohoku Univ., Sendai, Japan
fYear
2010
fDate
26-28 April 2010
Firstpage
1
Lastpage
4
Abstract
A very-thin Pt/W thermoelectric element is fabricated on a small chip. The Pt and W thin wires having the diameter of 5 ¿m are attached on a Cu electrode chip, and these are electrically isolated by air grove on the chip. The tips of both thin wires are welded by the technique of Joule heating. The other ends of wires are connected to a voltmeter. Temperature of the constructed electro-thermal circuit is controlled by flowing of the current through the circuit. The observed voltage is found to be proportional to the temperature difference between the dissimilar welding point and the chip (room temperature) which satisfies the Seebeck effect. The Seebeck coefficient is found to be about 0.2 ¿V/K. The temperature distribution of 5 ¿m Pt wire, where the constant current is flowing, is successfully measured by the fabricated very-thin Pt/W thermoelectric element.
Keywords
Seebeck effect; copper; integrated circuit interconnections; platinum; temperature distribution; thermocouples; tungsten; welding; Joule heat welding; Pt-W-Cu; Seebeck effect; air grove; electro thermal circuit; freestanding thin thermocouple; size 5 mum; small chip; temperature 293 K to 298 K; temperature distribution; thermoelectric element; Circuits; Electrodes; Fabrication; Heating; Temperature control; Thermoelectricity; Voltage; Voltmeters; Welding; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location
Bordeaux
Print_ISBN
978-1-4244-7026-6
Type
conf
DOI
10.1109/ESIME.2010.5464556
Filename
5464556
Link To Document