Title :
Dynamic capacity modeling [IC manufacture]
Author :
Mercier, James R.
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Abstract :
Semiconductor fabricators often experience large part number variations and short product lives which can lead to capacity shortfalls. Fluctuation in part number mix can lead to multiple pinch points in the production process. In order to contain wafer starts, new process qualification must be quickly implemented. However, this may introduce “risk” into the line work in process (WIP). In addition, any production pinch points will hamper the fabricator´s ability to maintain adequate line cycle time. This paper demonstrates a methodology that can be used to relate part number variation in the fabricator to the available tool capacity in various process sectors. This methodology allows for real time analysis, and is primarily intended for proactive management of capacity-constrained production sectors
Keywords :
integrated circuit manufacture; manufacturing resources planning; production control; semiconductor process modelling; IC manufacture; capacity shortfall; capacity-constrained production sectors; dynamic capacity modeling; line cycle time; line work in process; multiple process pinch points; part number mix; part number variation; part number variations; proactive management; process qualification; process sectors; product life; production pinch points; production process; real time analysis methodology; semiconductor fabricators; tool capacity; Capacity planning; Manufacturing processes; Microelectronics; Postal services; Process planning; Production facilities; Qualifications; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-4380-8
DOI :
10.1109/ASMC.1998.731476