DocumentCode
2359938
Title
CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure
Author
Belov, Ilja ; Lindgren, Mats ; Rydén, Jan ; Alavizadeh, Zahra ; Leisner, Peter
Author_Institution
Sch. of Eng., Jonkoping Univ., Jonkoping, Sweden
fYear
2010
fDate
26-28 April 2010
Firstpage
1
Lastpage
8
Abstract
Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.
Keywords
computational fluid dynamics; heating; humidity; packaging; printed circuit design; CFD assisted design evaluation; commercial-of-the-shelf electronic components; computational fluid dynamics; critical electronic packages; electronics enclosure; humidity management; logic controlled local PCB heater; printed circuit board heater; Computational fluid dynamics; Electronic components; Electronics packaging; Environmental management; Humidity control; Logic design; Logic devices; Printed circuits; Size control; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location
Bordeaux
Print_ISBN
978-1-4244-7026-6
Type
conf
DOI
10.1109/ESIME.2010.5464561
Filename
5464561
Link To Document