DocumentCode :
2360193
Title :
Filter design using electromagnetic band gap in microstrip reference plane for packaging applications
Author :
Yang, Bo Jhih ; Ku, Tzu An ; Ng, Sin Shyh ; Wu, Sung Mao
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear :
2010
fDate :
8-10 Dec. 2010
Firstpage :
815
Lastpage :
818
Abstract :
In the current trend of technologic products is light, small and high-speed, so electronic products widely applied in high frequency. Due to high frequency, the parasitic effects and more noise are generated. To solve this problem, we used to add the band-pass filters behind the signal line to enhance signal integrity (SI) and reduce noise. But this method required to increase size of the circuit. In this study, microstrip is reference plane, a novel EBG structure enable the microstrip become bandpass filter. This new structure is still a transmission line. A section of transmission line embeded EBG in the bottom of transmission lines.EBG combine with ground plane of transmission lines to enable the signal which is not in the pass band will not have return path. The section of microstrip which combine with EBG possess band-pass filter characteristics. The purposes not only reduce the area effectively, but also decrease the cost. This study designs a 4GHz and 2.4GHz bandpass filter structure. The feature in this specifications correspond with provisions of the current range of wireless communication frequency (2.4GHz), and broadcasting TV (4GHz), and in the future there will be more application development.
Keywords :
band-pass filters; electronics packaging; microstrip lines; photonic band gap; transmission lines; band-pass filters; electromagnetic band gap; electronic products; filter design; microstrip reference plane; packaging applications; signal integrity; transmission line; wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
Type :
conf
DOI :
10.1109/EPTC.2010.5702742
Filename :
5702742
Link To Document :
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