Title :
Flexible Circuits with embedded resistors subjected to extreme thermal loading conditions using the Shadow Moiré and FEM measurements techniques
Author :
Arruda, Luciano ; Marinho, Luanda ; Silva, Edson ; Machado, Willy
Author_Institution :
Inst. Nokia de Tecnol. - INdT, Manaus, Brazil
Abstract :
The objective of this work is to study flexible Printed Circuits Boards (fPCBs) using a ThermoMoire¿ chamber for measuring fPCBs surface warpage as a function of temperature in orders to evaluate its displacements. A 3-D computational modelling in a multilayer configuration will be used to compare with a typical FEM simulation. Additionally, it will be demonstrated a defect inspection using an Acoustic Scanning Microscope (SAM) to find delamination failure after a Thermal Shock Test (TST).
Keywords :
finite element analysis; printed circuits; resistors; thermal shock; 3D computational modelling; FEM measurements techniques; acoustic scanning microscope; embedded resistors; fPCB; flexible printed circuits boards; multilayer configuration; shadow Moire techniques; thermal shock test; Acoustic measurements; Computational modeling; Displacement measurement; Flexible printed circuits; Measurement techniques; Nonhomogeneous media; Resistors; Temperature; Thermal loading; Thermal resistance;
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
DOI :
10.1109/ESIME.2010.5464575
