Title :
UV curing kinetic of high performance epoxy resin for Roll-to-Roll UV embossing
Author :
Voytekunas, V. Yu ; Ng, F.L. ; Shan, X.C. ; Lu, C.W. ; Abadie, M.J.M.
Author_Institution :
Singapore Inst. of Manuf. Technol. (SIMTech), Singapore, Singapore
Abstract :
In present work curing kinetics of UV-initiated cationic photo-polymerization of EPICLON series epoxy resin HP-820 and key cure process parameters, such as the extent of cross-linking and conversion, polymerization rate and the order of reactions have been studied by Photo-Differential Scanning Calorimetry (DPC). Different kinetics analysis results, including enthalpy of the reaction, induction time, peak maximum, percentage conversion were obtained for studied epoxy system at different isothermal temperatures (30-70°C), allowing calculating activation energy. Two kinetic parameters - coefficient rate (k) and the order of the initiating reaction (m) were determined, using an autocatalytic kinetics model.
Keywords :
catalysis; curing; differential scanning calorimetry; embossing; enthalpy; polymerisation; reaction rate constants; resins; ultraviolet radiation effects; DPC; EPICLON series epoxy resin HP-820; UV curing kinetic; UV-initiated cationic photo-polymerization; activation energy; autocatalytic kinetics model; coefficient rate; cross-linking; enthalpy of the reaction; epoxy system; high performance epoxy resin; induction time; initiating reaction; isothermal temperatures; key cure process parameters; kinetic parameters; kinetics analysis; order of reactions; peak maximum; percentage conversion; photo-differential scanning calorimetry; polymerization rate; roll-to-roll UV embossing;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702743
