Title :
Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?
Author :
Banerjee, Kaustav ; Im, Sungjun ; Srivastava, Navin
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
Abstract :
Current earning capacity of copper interconnects is being severely limited due to their increasing resistivity with scaling and reliability constraints. Metallic carbon nanotubes (CNT) are promising candidates that can potentially address the challenges faced by copper and thereby extend the lifetime of on-chip electrical interconnects. This paper provides an overview of the state-of-the-art of CNT interconnect research and discusses both advantages and challenges of this emerging nanotechnology
Keywords :
carbon nanotubes; copper; integrated circuit interconnections; CNT interconnect; Cu; metallic carbon nanotubes; nanotechnology; on-chip electrical interconnections; Carbon nanotubes; Conductivity; Copper; Electrons; Fabrication; Grain boundaries; Integrated circuit interconnections; Scattering; Temperature; Wires; Carbon nanotubes; VLSI; copper; interconnects;
Conference_Titel :
Nano-Networks and Workshops, 2006. NanoNet '06. 1st International Conference on
Conference_Location :
Lausanne
Print_ISBN :
1-4244-0391-X
DOI :
10.1109/NANONET.2006.346235