Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers

Author

Tesarski, Sebastian J. ; Hölck, Ole ; Wymyslowski, Artur

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

4

Abstract

Molecular modeling is one of the fastest developing tools in material science. There are a couple of reasons of such a state: on one hand molecular modeling seems to be nowadays much more user friendly and on the other hand is much more efficient in comparison to research based on traditional experiments, which are quite expensive and long lasting. Though the basic problem of numerical analysis is accuracy, in certain cases we can agree with it as long as the predicted tendency or trends are assessed properly. Due to the current state of the art it is justified to formulate the assumption that that results of advanced numerical modeling fulfills expected convergence criteria and correlates well with the experimental data.

Keywords

glass transition; molecular dynamics method; polymers; thermal analysis; thermal expansion; crosslinked polymers; glass transition temperature; microelectronic packaging; molecular modeling; multiscale evaluation; nanoelectronic packaging; numerical analysis; scripting capability; thermal expansion; Algorithms; Epoxy resins; Materials science and technology; Microelectronics; Numerical analysis; Numerical models; Packaging; Photonics; Polymers; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464580

Filename

5464580