DocumentCode
2360390
Title
Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph
Author
Creutzburg, T. ; Gatzen, H.H.
Author_Institution
Inst. for Microtechnol., Leibniz Univ. Hannover, Garbsen, Germany
fYear
2010
fDate
26-28 April 2010
Firstpage
1
Lastpage
6
Abstract
The design of a microactuator serving as an implantable hearing aid to overcome ambylacousia was conducted by executing mechanical and thermal Finite Element Method (FEM) analyses using the ANSYS® software simulation tool. To do so, the deflection conditions to be fulfilled by the system were determined. The two challenges were to achieve a sufficiently high resonance frequency and to accommodate the physiological restrictions in the middle ear and the cochlea defining the maximal size of the microactuator. A model of the mechanical system was created and modal analyses were carried out. In the next step, the force required to deflect the membrane in the static case and under damping of the cochlea was simulated. In a last step, a 3-D thermal model of the complete system including the micromagnetics was created to investigate the temperature rise in the system. This is important with respect to the implantation of the actuator into the human body, avoiding a necrosis of the human tissue.
Keywords
bioMEMS; biothermics; ear; finite element analysis; hearing aids; microactuators; prosthetics; thermal analysis; 3D thermal model; ANSYS simulation tool; actuator implantation; ambylacousia; cochlea; deflection conditions; finite element method; implantable hearing aid; mechanical FEM analysis; microactuator design; microactuator maximal size; microactuator mechanical simulations; microactuator thermal simulations; micromagnetics; middle ear; modal analysis; perilymph stimulation; resonance frequency; thermal FEM analysis; Analytical models; Auditory system; Biological system modeling; Finite element methods; Humans; Microactuators; Resonance; Resonant frequency; Software tools; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location
Bordeaux
Print_ISBN
978-1-4244-7026-6
Type
conf
DOI
10.1109/ESIME.2010.5464582
Filename
5464582
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