Title :
DynaPlan: Resource placement for application-level clustering
Author :
Harper, Richard E. ; Ryu, Kyung Dong ; Frank, David ; Spainhower, Lisa ; Shankar, Ravi ; Weaver, Tom
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Creating a reliable computing environment from an unreliable infrastructure is a common challenge. Application-Level High Availability (HA) clustering addresses this problem by relocating and restarting applications when failures are detected. Current methods of determining the relocation target(s) of an application are rudimentary in that they do not take into account the myriad factors that influence an optimal placement. This paper presents DynaPlan, a method that improves the quality of failover planning by allowing the expression of a wide and extensible range of considerations, such as multidimensional resource consumption and availability, architectural compatibility, security constraints, location constraints, and policy considerations, such as energy-favoring versus performance-favoring. DynaPlan has been implemented by extending the IBM PowerHA clustering solution running on a group of IBM System P servers. In this paper, we describe the design, implementation, and preliminary performance evaluation of DynaPlan.
Keywords :
pattern clustering; resource allocation; software performance evaluation; system recovery; DynaPlan performance evaluation; IBM PowerHA clustering solution; IBM System P server; application level high availability clustering; failover planning quality; failure detection; reliable computing environment; relocation target detection; resource placement; restarting application; Availability; Image color analysis; Measurement; Planning; Resource management; Security; Servers; Clustering; Fail-over; High Availability; Optimization; Placement;
Conference_Titel :
Dependable Systems and Networks Workshops (DSN-W), 2011 IEEE/IFIP 41st International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4577-0374-4
Electronic_ISBN :
978-1-4577-0373-7
DOI :
10.1109/DSNW.2011.5958825