Title :
Challenges for silicon technology scaling in the nanoscale era
Author :
Chen, Tze-Chiang
Author_Institution :
T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
Abstract :
The continuous and systematic increase in transistor density and performance, as described in ldquoMoore´s Lawrdquo and guided by CMOS scaling theory, has been remarkably successful for the development of silicon technology for the past 40 years. As the silicon industry moves into sub-ten nanometer dimensions, significant technology challenges in device performance, power dissipation, and variability will be imposed by the approach toward atomistic and quantum-mechanical physics boundaries. These issues are frequently cited as the reason Moore´s Law is ldquobrokenrdquo, or why CMOS scaling is coming to an end. However, the infusion of new materials, device structures, and the exploitation of 3D-silicon integration, coupled with innovations in circuit design and system architecture, will ensure several more generations of continued CMOS development.
Keywords :
CMOS integrated circuits; elemental semiconductors; nanotechnology; quantum theory; silicon; 3D-silicon integration exploitation; CMOS scaling theory; Moore law; Si; atomistic physics boundary; circuit design; device performance; device structures; device variability; material infusion; nanoscale era; power dissipation; quantum-mechanical physics boundary; silicon industry; silicon technology scaling; system architecture; transistor density; CMOS technology; Composite materials; Compressive stress; Inorganic materials; MOSFETs; Moore´s Law; Nanoscale devices; Semiconductor materials; Silicon; Tensile stress;
Conference_Titel :
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location :
Athens
Print_ISBN :
978-1-4244-4351-2
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2009.5331481