DocumentCode :
2361289
Title :
Novel methodology to include all measured extension values per defect to improve defect size distributions
Author :
Hess, Christopher ; Weiland, Larg H.
Author_Institution :
Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany
fYear :
1998
fDate :
23-25 Sep 1998
Firstpage :
197
Lastpage :
202
Abstract :
Defect size distributions play an important role in process characterization and yield prediction. In order to reduce time and costs of defect size extraction procedures, the paper presents a novel methodology to determine defect size distributions. For that, we use all measured defect extension values per inspected defect, as compared to known methodologies which use just one size value per defect. Our approach enables reduction of the sample of defects to be inspected in semiconductor manufacturing fabs. Nevertheless, the novel methodology provides even better defect size distribution accuracy
Keywords :
inspection; integrated circuit measurement; integrated circuit reliability; integrated circuit yield; production testing; defect sample; defect size distribution; defect size distribution accuracy; defect size distribution methodology; defect size extraction procedure costs; defect size extraction procedure time; defect size extraction procedures; defect size value; inspected defects; measured defect extension values; process characterization; semiconductor manufacturing fabs; yield prediction; Costs; Distributed computing; Electric variables measurement; Fault tolerance; Inspection; Particle measurements; Semiconductor device manufacture; Semiconductor device measurement; Size measurement; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4380-8
Type :
conf
DOI :
10.1109/ASMC.1998.731553
Filename :
731553
Link To Document :
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