Reducing perfluorinated compound emissions [CVD chamber cleaning]

Author

Hines, Cynthia M. ; Pinto, James N. ; Izor, Raymond C. ; Tamayo, Thomas A. ; Miller, William J.

Author_Institution

Microelectron. Div., IBM Corp., Essex Junction, VT, USA

fYear

1998

fDate

23-25 Sep 1998

Firstpage

203

Lastpage

207

Abstract

Hexafluorethane (C₂F₆) is a perfluorinated compound (PFC) used extensively throughout the semiconductor industry to clean chemical vapor deposition (CVD) chambers. Although ongoing process improvements to the C₂F₆ clean are helping to reduce PFC emissions at the IBM Microelectronics Division 200 mm fabricator in Essex Junction, Vermont, based on the current US Environmental Protection Agency (EPA) emission guidelines, further reduction is needed. Alternative chemistry evaluations indicate that the use of nitrogen trifluoride (NF₃) diluted in helium (He) has the potential to significantly reduce PFC emissions

Keywords

chemical vapour deposition; environmental factors; integrated circuit technology; surface cleaning; surface contamination; CVD chamber cleaning; CVD chambers; He-NF₃; He-diluted NF₃ cleaning; PFC emissions; US EPA emission guidelines; US Environmental Protection Agency emission guidelines; chemical vapor deposition chambers; chemistry evaluation; cleaning; helium-diluted nitrogen trifluoride cleaning; hexafluorethane; perfluorinated compound; perfluorinated compound emission reduction; process improvements; semiconductor industry; Chemical vapor deposition; Chemistry; Cleaning; Electronics industry; Guidelines; Helium; Microelectronics; Nitrogen; Noise measurement; Protection;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

0-7803-4380-8

Type

conf

DOI

10.1109/ASMC.1998.731554

Filename

731554