DocumentCode :
2361307
Title :
Reducing perfluorinated compound emissions [CVD chamber cleaning]
Author :
Hines, Cynthia M. ; Pinto, James N. ; Izor, Raymond C. ; Tamayo, Thomas A. ; Miller, William J.
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear :
1998
fDate :
23-25 Sep 1998
Firstpage :
203
Lastpage :
207
Abstract :
Hexafluorethane (C2F6) is a perfluorinated compound (PFC) used extensively throughout the semiconductor industry to clean chemical vapor deposition (CVD) chambers. Although ongoing process improvements to the C2F6 clean are helping to reduce PFC emissions at the IBM Microelectronics Division 200 mm fabricator in Essex Junction, Vermont, based on the current US Environmental Protection Agency (EPA) emission guidelines, further reduction is needed. Alternative chemistry evaluations indicate that the use of nitrogen trifluoride (NF3) diluted in helium (He) has the potential to significantly reduce PFC emissions
Keywords :
chemical vapour deposition; environmental factors; integrated circuit technology; surface cleaning; surface contamination; CVD chamber cleaning; CVD chambers; He-NF3; He-diluted NF3 cleaning; PFC emissions; US EPA emission guidelines; US Environmental Protection Agency emission guidelines; chemical vapor deposition chambers; chemistry evaluation; cleaning; helium-diluted nitrogen trifluoride cleaning; hexafluorethane; perfluorinated compound; perfluorinated compound emission reduction; process improvements; semiconductor industry; Chemical vapor deposition; Chemistry; Cleaning; Electronics industry; Guidelines; Helium; Microelectronics; Nitrogen; Noise measurement; Protection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4380-8
Type :
conf
DOI :
10.1109/ASMC.1998.731554
Filename :
731554
Link To Document :
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