DocumentCode
2361885
Title
Copper interconnect technology-new paradigms for BEOL manufacturing
Author
Rose, Kenneth ; Mangaser, Ramon
Author_Institution
Center for Adv. Interconnect Sci. & Technol., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
1998
fDate
23-25 Sep 1998
Firstpage
347
Lastpage
353
Abstract
The advent of copper as a commercial interconnect process means radical changes in back-end-of-line (BEOL) manufacturing. We examine the future of BEOL manufacturing guided by the 1997 National Technology Roadmap for Semiconductors. Changing to copper and future BEOL yield trends are emphasized
Keywords
copper; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit yield; technological forecasting; BEOL manufacturing; BEOL yield trends; Cu; National Technology Roadmap for Semiconductors; back-end-of-line manufacturing; copper interconnect technology; interconnect process; Aluminum; CMOS technology; Clocks; Copper; Delay; Fabrication; Frequency estimation; Manufacturing processes; Materials science and technology; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-4380-8
Type
conf
DOI
10.1109/ASMC.1998.731586
Filename
731586
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