Title :
Field stop IGBTs with dynamic clamping capability - a new degree of freedom for future inverter designs?
Author :
Laska, T. ; Bässler, M. ; Miller, G. ; Schaffer, C. ; Umbach, F.
Author_Institution :
INFINEON TECHNOLOGIES AG, Munich
Abstract :
In this paper the dynamic clamping properties and design aspects of modern IGBT devices are discussed, a detailed characterization of a dynamic clamping optimized single IGBT chip is shown as well as the way to the integration into a big high current IGBT module. The upcoming possible advantages both for the designer of an inverter as well as for the chip producer are addressed. Also hints are given concerning the topics to solved before product introduction like suitable diode design as well as all reliability aspects
Keywords :
diodes; insulated gate bipolar transistors; invertors; IGBT device; chip producer; diode design; dynamic clamping capability; inverter designs; reliability aspects; Chip scale packaging; Clamps; Diodes; Inductance; Insulated gate bipolar transistors; Inverters; Modems; Testing; Uniform resource locators; Voltage; Design; Device Application; Device Characterization; IGBT; Reliability;
Conference_Titel :
Power Electronics and Applications, 2005 European Conference on
Conference_Location :
Dresden
Print_ISBN :
90-75815-09-3
DOI :
10.1109/EPE.2005.219608
