DocumentCode
2362336
Title
Field stop IGBTs with dynamic clamping capability - a new degree of freedom for future inverter designs?
Author
Laska, T. ; Bässler, M. ; Miller, G. ; Schaffer, C. ; Umbach, F.
Author_Institution
INFINEON TECHNOLOGIES AG, Munich
fYear
2005
fDate
11-14 Sept. 2005
Abstract
In this paper the dynamic clamping properties and design aspects of modern IGBT devices are discussed, a detailed characterization of a dynamic clamping optimized single IGBT chip is shown as well as the way to the integration into a big high current IGBT module. The upcoming possible advantages both for the designer of an inverter as well as for the chip producer are addressed. Also hints are given concerning the topics to solved before product introduction like suitable diode design as well as all reliability aspects
Keywords
diodes; insulated gate bipolar transistors; invertors; IGBT device; chip producer; diode design; dynamic clamping capability; inverter designs; reliability aspects; Chip scale packaging; Clamps; Diodes; Inductance; Insulated gate bipolar transistors; Inverters; Modems; Testing; Uniform resource locators; Voltage; Design; Device Application; Device Characterization; IGBT; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2005 European Conference on
Conference_Location
Dresden
Print_ISBN
90-75815-09-3
Type
conf
DOI
10.1109/EPE.2005.219608
Filename
1665798
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