DocumentCode :
2362555
Title :
On-chip cache memory resilience
Author :
Hwang, Seung H. ; Choi, Gwan S.
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
fYear :
1998
fDate :
13-14 Nov 1998
Firstpage :
240
Lastpage :
247
Abstract :
This paper investigates the system-level impact of soft errors occurring in cache memory and proposes a novel cache-memory design approach for improving the soft-error resilience. Radiation experiments are conducted to quantify the severity of errors attributed to transients occurring in a cache memory subsystem. Simulation-based fault injections are then conducted to determine major failure modes and to assess the cost/benefits in cache memory designs/configuration alternatives. The performance, reliability, and overhead for each design configuration, e.g., cache block-size and write policy, are studied. The results indicate that the performance enhancement approaches using large cache block-sizes can adversely affect the soft-error sensitivity of the system. Write-through cache design is more susceptible to incomplete/incorrect program termination, while write-back cache design is more prone to data corruptions. A resilient cache design scheme, selective set invalidation (SSI), that better scrubs the cache-memory errors is proposed and evaluated
Keywords :
cache storage; cost-benefit analysis; fault tolerant computing; memory architecture; performance evaluation; cost benefit analysis; data corruption; design configuration; large cache block-sizes; on-chip cache memory resilience; performance; program termination; radiation experiments; reliability; selective set invalidation; simulation-based fault injections; soft errors; write-back cache design; write-through cache design; Argon; Bridges; Cache memory; Central Processing Unit; Cyclotrons; Electrical capacitance tomography; Microprocessors; Resilience; Single event upset; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High-Assurance Systems Engineering Symposium, 1998. Proceedings. Third IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-9221-9
Type :
conf
DOI :
10.1109/HASE.1998.731620
Filename :
731620
Link To Document :
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